PRODUCT TYPE

MCPCB

※1~12W/Mk High-thermal conductivity dielectric bonding material available.

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FR4

※24 Layer
(Blind and Burried Via)

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DBC (Direct Bond Copper)

※Copper thickness 0.127 – 0.5 mm

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OTHER

※Micro Via /
Micro Wave

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產品介紹

LED散熱金屬板

※可生產1~12W/mk導熱膠,充分滿足市場需求...

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FR4

※最高可生產24層

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DBC (Direct Bond Copper)

※Copper thickness 0.127 – 0.5 mm

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其 他

※微波通訊板

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