PSC Technology Roadmap

A) Metal Core PCB 
Process step Items Current status Technology Readiness
E/2015 E/2016 E/2017
Material for Metal core PCB Aluminum Type : 5052 / 6061 / 1100 / 1050 series Yes Yes Yes Yes
Copper Type : C1100 Yes Yes Yes Yes
Metal substrat thickness:   Max. Thickness: (mm) 3 3 4 4
    Min. Thickness: (mm) 0.3 0.15 0.1 0.1
Thermal conductivity Prepreg
coeficient of thermal conductivity:1~3     w/mk Yes Yes Yes Yes
coeficient of thermal conductivity:4     w/mk Yes Yes Yes Yes
coeficient of thermal conductivity:5 , 6    w/mk Yes Yes Yes Yes
 coeficient of thermal conductivity:8     w/mk Yes Yes Yes Yes
coeficient of thermal conductivity:12     w/mk Sample Yes Yes Yes
Thermal conductivity CEM3 Yes Yes Yes Yes
Design Guide Board Dimension Singel Layer:  Max. Panel Size (mm) 550x820 550x990 550x1060 550x1220
                         Max. Array Size (mm) 550x820 550x990 550x1060 550x1220
Double Layer:Max. Panel Size (mm) 550x770 550x770 550x850 550x990
                         Max. Array Size 520x740 520x740 520x820 520x960
Inner Layer Min. Trace Width / Space (mil)      Double  Layer 4/4 4/4 4/4 4/4
Max.Copper Weight (oz.) 2 3 4 4
Min.. Core Thickness(oz.) 2 3 3 3
Lamination Max. Layer Count                                                          (Double-sided Multilayer) (w/  T.H) 1+1 1+1 2+2 TBD
(Double-sided Multilayer)  (w/o  T.H) 6+6 6+6 TBD TBD
Max. Layer Count(one-sided) 6 6 6 TBD
Drill&Plating Min. Plated Hole Size (mil)            Double  Layer 10 10 8 8
Min. Mounting Hole size(mm)
(Board Thk. < 0.5 mm)
0.5 0.5 0.4 0.4
Min. Mounting Hole size
(Board Thk. < 0.5 mm) Aspect ratio ≦
1.36 1.36 1 1
Min Punch Hole size (mm)
Aspect ratio ≦
1 1 1 TBD
Min. Hole to Hole Pitch (mil) 40 40 32 24
Outer Layer Min. Trace Width/ Space Singel Layer(1 oz.)  
Board Length. ≦ 770 mm     3.5/3.5 3.5/3.5 3.5/3.5 3/3
7705/55/5TBDTBD
85020/2020/20TBDTBD
Min. Trace Width / Space      Double Layer(1oz.) 3.5/3.5 3.5/3.5 TBD TBD
Max. Finished Trace Copper Thickness(oz.) 5 5 6 8
Available Surface Finish (SMT process) ENIG Yes Yes Yes Yes
ENEPIG Yes Yes Yes Yes
Immersion Silver Yes Yes Yes Yes
Silver electric plating Yes Yes Yes Yes
Immersion Tin Yes Yes Yes Yes
H.A.S.L (Lead Free) Yes Yes Yes Yes
OSP Yes Yes Yes Yes
Available Surface Finish (COB process) ENEPIG Yes Yes Yes Yes
Electric Silver plating Yes Yes Yes Yes
ENIG(Au: 10u"↑) Yes Yes Yes Yes
Others Concave cup  Yes Yes Yes Yes
Pedestal (Copper base) Yes Yes Yes Yes
Bendable MCPCB Yes Yes Yes Yes
Screw hole tapping Yes Yes Yes Yes
Countersink hole Yes Yes Yes Yes
Blind drilling Yes Yes Yes Yes
Anodic treatment Yes Yes Yes Yes
High reflective Aluminum Yes Yes Yes Yes
Max. Thickness (mm) 1 1 TBD TBD
B) Technology Roadmap for HDI
Process step Items Current status Technology Readiness
E/2015 E/2016 E/2017
HDI     Structure       1+N+1(w/o buried via) Yes Yes Yes Yes
1+N+1(w/o buried via) Yes Yes Yes Yes
Lid plating on buried via Yes Yes Yes Yes
Stagger via(L1-2 , L2-3) Sample Yes Yes Yes
Stagger via , Buried via, 4/4 trace , Laser +PP Sample Yes Yes Yes
Skip via(L1-3) Yes Yes Yes Yes
Step via(L1-2-3) No Sample Yes Yes
Design Guide Min. IVH core thickness (mil)  4 4 3 3
Min. Laser via diameter (mil) 4 4 3 3
Aspect ratio 0.8 0.8 1 1.2
C) Technology Roadmap for HLC
Process step Items Current status Technology Readiness
E/2015 E/2016 E/2017
Board Dimension Max. Board Thickness      (mm) 4 4 5 TBD
Min. Board Thickness(Multilayer)  (mm) 0.4 0.4 0.4 0.4
Max. Panel Dimension  (inch) 20x24 20x24 21x24 22x24
Max.Finished Board size  (inch) 18x20 18x20 19x21 20x22
Inner Layer Min. Trace Width / Space    (mil) 4/4 4/4 3.5/3.5 3/3
Max. Copper Weight  (oz.) 4 4 5 5
Min. Core Thickness    (mil) 3 3 2 2
Lamination Layer Count 24 24 26 TBD
Layer to Layer Registration  (+/- mil) 5 5 4 4
Drilling Min. Drill size (Plated Hole)  (mil) 10 10 8 8
Min. Hole to Hole Pitch 40 40 32 24
Plating Aspect Ratio 8:1 8:1 10:1 12:1
Outer Layer Trace Width / Space   (mil) 4/4 4/4 3/3 2.5/2.5
Finished Trace Copper Thickness  (oz.) 5 5 8 8
Solder Mask Solder Mask Dam Width 4 4 3.5 3
Solder Mask Registration Tolerance (+/- mil) 3 2 2 1.5
Routing Depth Control Routing Yes Yes Yes Yes
Testing Impedance Control Tolerance (%) +/-10% +/-10% +/-7% +/-7%
Differential Impedance Control Tolerance(%) +/-10% +/-10% +/-7% +/-7%
Smallest SMT Pitch 10 10 10 10
Smallest BGA Pitch 32 32 20 16
Others Buried Capacitance (paste) No No Sample Yes
Material for CCL & Prepreg
A) FR4 PCB
Material Items Current status Technology Readiness
E/2015 E/2016 E/2017
FR4 - High Tg  Tg = 150℃ / 170℃ / 180℃ / 215℃ Yes Yes Yes Yes
FR4 - Lead Free process  Tg = 150℃ / 170℃ / 180℃ / 215℃ Yes Yes Yes Yes
Halogen free  Tg = 150℃ Yes Yes Yes Yes
Tg = 180℃ Sample Yes Yes Yes
RF production Isola FR408         Tg = 175 oC Yes Yes Yes Yes
                             Dk = 3.8 Yes Yes Yes Yes
Rogers  RO3003  ( Teflon )  Dk = 3.0 Yes Yes Yes Yes
             RO4003 / RO4350B / RO4223 Yes Yes Yes Yes
GeTek RG200D  Tg = 185 oC Yes Yes Yes Yes
                             Dk = 4.2 Yes Yes Yes Yes
            ML200D  Tg = 175 oC Yes Yes Yes Yes
                             Dk = 3.8 Yes Yes Yes Yes
Panasonic  R5715/R5610G     Tg = 180 oC Yes Yes Yes Yes
                             Dk = 3.9 Yes Yes Yes Yes
                 R5725/R5620        Tg = 180 oC Yes Yes Yes Yes
                             Dk = 3.9 Yes Yes Yes Yes
B) Metal Core PCB
Material Items Current status Technology Readiness
E/2015 E/2016 E/2017
Thermal Conductive Prepreg / CCL Laird               1KA           prepreg         k= 3 w/mk Yes Yes Yes Yes
Bergquist         MP MCPCB         k=1.3 w/mk Yes Yes Yes Yes
                  HR( T30.20) MCPCB         k=1.3 w/mk Yes Yes Yes Yes
NRK               NRA-8  MCPCB        k= 1.8 w/mk Sample Yes Yes Yes
                       NRA-ES1  MCPCB        k= 1.7 w/mk Yes Yes Yes Yes
EMC              EM-MP   Yes Yes Yes Yes
                       EM-M1   Yes Yes Yes Yes
NAN YA       NPRCHA   Yes Yes Yes Yes
                   CEM-3-01HC   Yes Yes Yes Yes
                   CEM-3-09HT CEM3/CCL  k= 1.0 w/mk Yes Yes Yes Yes
Panasonic    ECOOL   Yes Yes Yes Yes
TEQ            IT-859GTA      prepreg        k= 3.0 w/mk Yes Yes Yes Yes
PTTC            TCP  prepreg        k= 3.0 4.0 8.0 w/mk Yes Yes Yes Yes
                      TCP-12  prepreg        k=12.0 w/mk Sample Sample Yes Yes
CSEM           AD2 MCPCB        k= 2.0 3.0 5.0 w/mk Yes Yes Yes Yes
  MCPCB        k= 12.0 w/mk Sample Sample Yes Yes
DuPont   CooLam 3D MCPCB       Bendable MCPCB Yes Yes Yes Yes
White colored core Risho           CS-3965V Yes Yes Yes Yes
AMC           AMC-820WHFE Yes Yes Yes Yes
Ventec         VT-820W Yes Yes Yes Yes
Mirror-Silver Aluminum Analod         MIRO 2 Yes Yes Yes Yes
                    MIRO 17 Yes Yes Yes Yes
Almeco       VLB198 Yes Yes Yes Yes
C) Micro Wave PCB
Process step Items Current status Technology Readiness
E/2014 E/2015 E/2016
ROGERS  CCL RO3003  ( Teflon )  Dk = 3.0 Yes Yes Yes Yes
RO4003 / RO4350B / RO4223 Yes Yes Yes Yes
Arlon CCL Diclad 522 / 527 , 870 / 880 , 250GT / 250GX Sample Yes Yes Yes
25N / 25FR (ceramic filled )  Dk = 3.38 / 3.58 Yes Yes Yes Yes
Isola CCL IS640   IS680   Dk = 3.45   Yes Yes Yes Yes
Nelco CCL N4000-13SI     Dk = 3.5 Yes Yes Yes Yes
Panasonic CCL Megtron      Dk = 3.9 Yes Yes Yes Yes
Available Finish :  RoHS compliance
Items Current status Technology Readiness
E/2014 E/2015 E/2016
 O.S.P. Yes Yes Yes Yes
Immersion silver ( Mac Dermid )  Yes Yes Yes Yes
Immersion White Tin ( Omikron ) Yes Yes Yes Yes
Lead Free HASL Yes Yes Yes Yes
Electroless Nickel / Immersion gold  Yes Yes Yes Yes
Electroless Nickel / Electroless Padium / Immersion gold  Yes Yes Yes Yes
Carbon ink  ( Peters ) Yes Yes Yes Yes
Peelable Mask ( Peters ) Yes Yes Yes Yes
Silver Plating   Yes Yes Yes Yes
Nickel Plating   Yes Yes Yes Yes
Gold Finger Plating Yes Yes Yes Yes
Selective Plating : OSP + Gold plating Yes Yes Yes Yes
                                 OSP + ENIG   Yes Yes Yes Yes