PSC Technology Roadmap

 
A) Technology Roadmap for HDI
Process step Items Current status Technology Readiness
E/2021 E/2022 E/2023
HDI Structure 1+N+1(w/o buried via) Yes Yes Yes Yes
1+N+1(w/ buried via) Yes Yes Yes Yes
Lid plating on buried via Yes Yes Yes Yes
Stagger via(L1-2 , L2-3) Yes Yes Yes Yes
Stagger via , Buried via, 3/3 trace , Laser +PP Sample Yes Yes Yes
Stacked via(L1-3) , via hole plugged with resin Yes Yes Yes Yes
Stacked via(L1-3) , via hole plugged with copper plating No No Sample Yes
Stacked via(L1-2-3) , via plug with resin No Sample Yes Yes
Design Guide Min. IVH core thickness (mil) 3 3 2 2
Min. Laser via diameter (mil) 4 4 3 3
Aspect ratio(PTH) 8:1 10:1 20:1 TBD
Aspect ratio(Laser via) 0.64 0.8 0.8 TBD

B) Technology Roadmap for HLC
Process step Items Current status Technology Readiness
E/2021 E/2022 E/2023
Board Dimension Max. Board Thickness (mm) 4 4.9 5 TBD
Min. Board Thickness(Multilayer) (mm) 0.4 0.4 0.4 0.4
Max. Panel Dimension (inch) - Multi layer 20x24 20x24 21x24 22x24
Max.Finished Board size (inch) - Multi layer 18x20 18x20 19x21 20x22
Inner Layer Min. Trace Width / Space(mil) - H oz. copper thickness 3/3 3/3 2.5/2.5 2/2
Max. Copper Weight (oz.) 4 6 TBD TBD
Min. Core Thickness (mil) 3 3 2 2
Lamination Layer Count 24 24 26 TBD
Layer to Layer Registration (+/- mil) 4 4 3 3
Drilling Min. Drill size (Plated Hole) (mil) 8 8 6 6
Min. Hole to Hole Pitch 40 40 32 24
Plating Aspect Ratio 8:1 10:1 20:1 TBD
Outer Layer Trace Width / Space (mil) - 1 oz. copper thickness 4/4 3/3 2.5/2.5 2/2
Finished Trace Copper Thickness (oz.) 8 8 8 8
Solder Mask Solder Mask Dam Width 4 3 3 2
Solder Mask Registration Tolerance (+/- mil) 3 3 2 1.5
Routing Depth Control Routing Yes Yes Yes Yes
Testing Impedance Control Tolerance (%) +/-10% +/-10% +/-7% +/-7%
Differential Impedance Control Tolerance(%) +/-10% +/-10% +/-7% +/-7%
Smallest SMT Pitch 10 10 10 10
Smallest BGA Pitch 32 32 20 16

C) Metal Core PCB
Process step Items Current status Technology Readiness
E/2021 E/2022 E/2023
Material for Metal core PCB Aluminum Type : 5052 / 6061 / 1100 / 1050 series Yes Yes Yes Yes
Copper Type : C1100 Yes Yes Yes Yes
Metal substrat thickness: Max. Thickness: (mm) 3.2 3.2 3.5 4
Metal substrat thickness: Min. Thickness: (mm) 0.15 0.15 TBD TBD
Thermal conductivity Prepreg
coeficient of thermal conductivity:0.6W/mk (FR4+Metal) Yes Yes Yes Yes
coeficient of thermal conductivity:1, 2, 3, 5, 8 w/mk Yes Yes Yes Yes
Thermal conductivity CEM3 Yes Yes Yes Yes
Design Guide Board Dimension Single Layer: Max. Panel Size (mm) 550x990 550x990 550x990 TBD
Single Layer:Max. Array Size (mm) 530x970 530x970 530x970 TBD
Double Layer:Max. Panel Size (mm) 550x720 550x850 550x850 TBD
Double Layer:Max. Array Size 530x700 530x700 530x700 TBD
Inner Layer Min.Trace Width/Space(mil)Double Layer 4/4 3.5/3.5 3/3 2.5/2.5
Max.Copper Weight (oz.) 3 3 4 4
Min.. Core Thickness(mil.) 3 3 2 2
Lamination Max. Layer Count (Double-sided Multilayer) (w/ T.H) 1+1 2+2 2+2 TBD
(Double-sided Multilayer) (w/o T.H) 6+6 6+6 TBD TBD
Max. Layer Count(one-sided) 6 6 6 TBD
Drill&Plating Min.Plated Hole Size (mil) Double Layer 10 8 8 8
Min. Mounting Hole size (mm) (Board Thk. < 0.5 mm) 0.5 0.5 0.4 0.4
Min. Mounting Hole size (Board Thk. < 0.5 mm) Aspect ratio ≦ 1.36 1.36 1 1
Min Punch Hole size (mm) Aspect ratio≦ 1 1 1 TBD
Min. Hole to Hole Pitch (mil) 40 40 32 24
Outer Layer Min. Trace Width / Space Singel Layer(1oz.)  
Board Length. ≦ 770 mm 3.5/3.5 3/3 2.5/2.5 2/2
770 <Board Length. ≦ 850 mm 5/5 5/5 TBD TBD
850 <Board Length. ≦ 990 mm 20/20 15/15 10/10 TBD
Min. Trace Width/space Double Layer(1oz.) 4/4 3.5/3.5 10 TBD
Max. Finished Trace Copper Thickness(1oz.) 5 6 6 8
Available Surface Finish (SMT process) ENIG Yes Yes Yes Yes
ENEPIG Yes Yes Yes Yes
Immersion Silver Yes Yes Yes Yes
Silver electric plating Yes Yes Yes Yes
Immersion Tin Yes Yes Yes Yes
H.A.S.L (Lead Free) Yes Yes Yes Yes
OSP Yes Yes Yes Yes
Available Surface Finish (COB process) ENEPIG Yes Yes Yes Yes
Electric Silver plating Yes Yes Yes Yes
ENIG(Au: 10u"↑) Yes Yes Yes Yes
Others Concave cup Yes Yes Yes Yes
Copper bump (Copper base) Yes Yes Yes Yes
Bendable MCPCB Yes Yes Yes Yes
Screw hole tapping Yes Yes Yes Yes
Countersink hole ; Counterboard Yes Yes Yes Yes
Blind drilling Yes Yes Yes Yes
Anodic treatment Yes Yes Yes Yes

D) Flex & Rigid-Flex PCB
Process step Items Current status Technology Readiness
E/2021 E/2022 E/2023
Polyimide CCL PI , adhesive/adhesiveless CCL , RA/ED copper Yes Yes Yes Yes
Halogen Free PI / Halogen Free-FR4 Yes Yes Yes Yes
High Tg FCCL Sample Yes Yes Yes
High Frequency CVL & Bonding sheet Sample Sample Yes Yes
Design Guide Board Dimension Max. Panel Size (inch) 10x16 10x16 18x24 18x24
Min. Panel Size (inch) 10x8 10x8 10x8 10x8
Inner Layer Min. Trace Width / Space (mil) 3.5/3.5 3/3 2.5/2.5 TBD
Max.Copper Weight (oz.) 2 2 3 3
Min.Copper Weight (oz.) 1/3 1/4 1/4 1/4
Max. FCCL Core Thickness (mil) 2 2 2 2
Min. FCCL Core Thickness (mil) 0.5 0.5 0.5 0.5
Lamination Max. Layer Count (Flex) 4 6 8 TBD
Max. Layer Count(Rigid-Flex) 8 12 TBD TBD
Drill&Plating Min. Plated Hole Size (mil) 10 8 8 8
  Max. Hole Aspect Ratio 6:1 6:1 8:1 10:1
Outer Layer Min. Trace Width / Space 3.5/3.5 3/3 2.5/2.5 2.5/2.5
Available Surface Finish ENIG Yes Yes Yes Yes
Immersion Silver Yes Yes Yes Yes
Immersion Tin Yes Yes Yes Yes
OSP Yes Yes Yes Yes
Solder Mask Min. Solder Mask Thickness (mil) 0.4 0.4 0.4 0.4
Min. Solder Mask Dam Width (mil) 4 3 3 3
Routing Punch Tolerance (+/- mm) 0.1 0.1 0.1 0.1
Routing Tolerance (+/- mm) 0.15 0.15 0.1 0.1
Others Coverlayer Paste Tolerance (+/- mil) 12 10 8 6
Resinforce Paste (+/- mil) 20 16 12 12
Adhesive Paste (+/- mil) 20 16 12 12

Material for CCL & Prepreg
A) FR4 PCB
Material Items Current status Technology Readiness
E/2021 E/2022 E/2023
FR4 - High Tg  Tg = 150℃ / 170℃ / 180℃ / 215℃ Yes Yes Yes Yes
FR4-Lead Free process  Tg = 150℃ / 170℃ / 180℃ / 215℃ Yes Yes Yes Yes
Halogen free  Tg = 150℃ Yes Yes Yes Yes
Tg = 170℃ Yes Yes Yes Yes
RF Products
(Low Dk Low Df)
Isola FR408 FR408HR Yes Yes Yes Yes
IS640 IS680 Yes Yes Yes Yes
I-Tera MT40 Tg = 200℃ Df = 0.0033 Dk3.75 Sample Yes Yes Yes
Astra MT77 Tg = 200℃ Df = 0.0017 Dk3 Sample Yes Yes Yes
Rogers RO4003 / RO4350B / RO4223 / RO4835 Yes Yes Yes Yes
RO3003 ( Teflon ) Dk = 3.0 Yes Yes Yes Yes
TUC TU-872LK TU-883 Yes Yes Yes Yes
TU-933 Sample Yes Yes Yes
PegaClad1(TU-1300 E) Tg = 220℃ Df = 0.0037 Dk3.6 Sample Yes Yes Yes
PegaClad1(TU-1300 N) Tg = 220℃ Df = 0.0037 Dk3.6 Sample Yes Yes Yes
EMC EM-888 Tg = 170℃ Df = 0.0055 Dk3.8 Sample Yes Yes Yes
EM-890 Tg = 170℃ Df = 0.0036 Dk3.0 Sample      
EM-890K Tg = 170℃ Df = 0.0024 Dk2.8 Sample Yes Yes Yes

B) Metal Core PCB
Material Items Current status Technology Readiness
E/2021 E/2022 E/2023
Thermal Conductive Prepreg / CCL Bergquis MP MCPCB k=1.3 w/mk Yes Yes Yes Yes
HR( T30.20) MCPCB k=1.3 w/mk Yes Yes Yes Yes
HT MCPCB k=2.2 w/mk Yes Yes Yes Yes
NRK NRA-8 MCPCB k= 1.8 w/mk Yes Yes Yes Yes
NRA-ES1 MCPCB k= 1.7 w/mk Yes Yes Yes Yes
EMC EM-MP prepreg k= 2.0 w/mk Yes Yes Yes Yes
EM-M1 MCPCB k= 3.0 w/mk Yes Yes Yes Yes
NAN YA CEM-3-01HC CEM3/CCL k= 1.5 w/mk Yes Yes Yes Yes
Panasonic ECOOL CEM3/CCL k= 1.5 w/mk Yes Yes Yes Yes
Ventec VT-4A2H prepreg k= 2.2 w/mk Yes Yes Yes Yes
VT-4B MCPCB k= 3.0 5.0 w/mk Yes Yes Yes Yes
PTTC TCP prepreg k= 2.0 3.0 4.0 8.0 w/mk Yes Yes Yes Yes
White colored core Risho CS-3965V Yes Yes Yes Yes
AMC AMC-820WHFE Yes Yes Yes Yes

Available Finish : RoHS compliance
Items Current status Technology Readiness
E/2021 E/2022 E/2023
 O.S.P. Yes Yes Yes Yes
Immersion silver ( Mac Dermid )  Yes Yes Yes Yes
Immersion White Tin ( Omikron ) Yes Yes Yes Yes
Lead Free HASL Yes Yes Yes Yes
Electroless Nickel / Immersion gold  Yes Yes Yes Yes
Electroless Nickel / Electroless Padium / Immersion gold  Yes Yes Yes Yes
Carbon ink  ( Peters ) Yes Yes Yes Yes
Peelable Mask ( Peters ) Yes Yes Yes Yes
Silver Plating   Yes Yes Yes Yes
Nickel Plating   Yes Yes Yes Yes
Gold Finger Plating Yes Yes Yes Yes
Selective Plating : OSP + Gold plating Yes Yes Yes Yes
Selective Plating : OSP + ENIG   Yes Yes Yes Yes
Selective Plating : ENIG+Gold plating Yes Yes Yes Yes