PSC Technology Roadmap

A) Technology Roadmap for HDI
Process step Items Current status Technology Readiness
E/2019 E/2020 E/2021
HDI     Structure       1+N+1(w/o buried via) Yes Yes Yes Yes
1+N+1(w/o buried via) Yes Yes Yes Yes
Lid plating on buried via Yes Yes Yes Yes
Stagger via(L1-2 , L2-3) Yes Yes Yes Yes
Stagger via , Buried via, 4/4 trace , Laser +PP Sample Yes Yes Yes
Skip via(L1-3) Sample Yes Yes Yes
Step via(L1-2-3) No Sample Yes Yes
Design Guide Min. IVH core thickness (mil)  4 4 3 3
Min. Laser via diameter (mil) 4 4 3 3
Aspect ratio(PTH) 8:1 8:1 10:1 TBD
Aspect ratio(Laser via) 0.64 0.8 1 TBD

B) Technology Roadmap for HLC
Process step Items Current status Technology Readiness
E/2019 E/2020 E/2021
Board Dimension Max. Board Thickness      (mm) 4 4.9 5 TBD
Min. Board Thickness(Multilayer)  (mm) 0.4 0.4 0.4 0.4
Max. Panel Dimension  (inch) 20x24 20x24 21x24 22x24
Max.Finished Board size  (inch) 18x20 18x20 19x21 20x22
Inner Layer Min. Trace Width / Space    (mil) 4/4 3/3 2.5/2.5 2/2
Max. Copper Weight  (oz.) 4 46 TBD TBD
Min. Core Thickness    (mil) 3 3 2 2
Lamination Layer Count 24 24 26 TBD
Layer to Layer Registration  (+/- mil) 5 5 3 3
Drilling Min. Drill size (Plated Hole)  (mil) 10 8 8 8
Min. Hole to Hole Pitch 40 40 32 24
Plating Aspect Ratio 8:1 8:1 10:1 TBD
Outer Layer Trace Width / Space   (mil) 4/4 3/3 2.5/2.5 2
Finished Trace Copper Thickness  (oz.) 5 5 8 8
Solder Mask Solder Mask Dam Width 4 3 3 2
Solder Mask Registration Tolerance (+/- mil) 3 2 2 1.5
Routing Depth Control Routing Yes Yes Yes Yes
Testing Impedance Control Tolerance (%) +/-10% +/-10% +/-7% +/-7%
Differential Impedance Control Tolerance(%) +/-10% +/-10% +/-7% +/-7%
Smallest SMT Pitch 10 10 10 10
Smallest BGA Pitch 32 32 20 16

C) Metal Core PCB 
Process step Items Current status Technology Readiness
E/2019 E/2020 E/2021
Material for Metal core PCB Aluminum Type : 5052 / 6061 / 1100 / 1050 series Yes Yes Yes Yes
Copper Type : C1100 Yes Yes Yes Yes
Metal substrat thickness:   Max. Thickness: (mm) 3.2 3.5 4 4
    Min. Thickness: (mm) 0.3 0.15 TBD TBD
Thermal conductivity Prepreg
coeficient of thermal conductivity:0.6W/mk (FR4+Metal) Yes Yes Yes Yes
coeficient of thermal conductivity:1, 2, 3, 5, 8 w/mk Yes Yes Yes Yes
Thermal conductivity CEM3 Yes Yes Yes Yes
Design Guide Board Dimension Singel Layer:  Max. Panel Size (mm) 550x990 550x990 550x990 TBD
                         Max. Array Size (mm) 550x970 550x970 550x970 TBD
Double Layer:Max. Panel Size (mm) 550x720 550x850 550x850 TBD
                         Max. Array Size 520x700 520x700 520x700 TBD
Inner Layer Min. Trace Width / Space (mil)      Double  Layer 4/4 3.5/3.5 3/3 2.5/2.5
Max.Copper Weight (oz.) 3 3 4 4
Min.. Core Thickness(oz.) 3 3 2 2
Lamination Max. Layer Count                                                          (Double-sided Multilayer) (w/  T.H) 1+1 2+2 2+2 TBD
(Double-sided Multilayer)  (w/o  T.H) 6+6 6+6 TBD TBD
Max. Layer Count(one-sided) 6 6 6 TBD
Drill&Plating Min. Plated Hole Size (mil)            Double  Layer 10 8 8 8
Min. Mounting Hole size(mm)
(Board Thk. < 0.5 mm)
0.5 0.5 0.4 0.4
Min. Mounting Hole size
(Board Thk. < 0.5 mm) Aspect ratio ≦
1.36 1.36 1 1
Min Punch Hole size (mm)
Aspect ratio ≦
1 1 1 TBD
Min. Hole to Hole Pitch (mil) 40 40 32 24
Outer Layer Min. Trace Width/ Space Singel Layer(1 oz.)  
Board Length. ≦ 770 mm     3.5/3.5 3/3 2.5/2.5 2/2
770 <Board Length. ≦ 850 mm 5/5 5/5 TBD TBD
850 <Board Length. ≦ 990 mm 15/15 15/15 10/10 TBD
Min. Trace Width / Space      Double Layer(1oz.) 4/4 3.5/3.5 10 TBD
Max. Finished Trace Copper Thickness(oz.) 5 6 6 8
Available Surface Finish (SMT process) ENIG Yes Yes Yes Yes
ENEPIG Yes Yes Yes Yes
Immersion Silver Yes Yes Yes Yes
Silver electric plating Yes Yes Yes Yes
Immersion Tin Yes Yes Yes Yes
H.A.S.L (Lead Free) Yes Yes Yes Yes
OSP Yes Yes Yes Yes
Available Surface Finish (COB process) ENEPIG Yes Yes Yes Yes
Electric Silver plating Yes Yes Yes Yes
ENIG(Au: 10u"↑) Yes Yes Yes Yes
Others Concave cup  Yes Yes Yes Yes
Copper bump (Copper base) Yes Yes Yes Yes
Bendable MCPCB Yes Yes Yes Yes
Screw hole tapping Yes Yes Yes Yes
Countersink hole ; Counterboard Yes Yes Yes Yes
Blind drilling Yes Yes Yes Yes
Anodic treatment Yes Yes Yes Yes

D) Flex & Rigid-Flex PCB
Process step Items Current status Technology Readiness
E/2019 E/2020 E/2021
Material for Metal core PCB PI , adhesive/adhesiveless CCL , RA/ED copper Yes Yes Yes Yes
Halogen Free PI / Halogen Free-FR4 Yes Yes Yes Yes
High Tg FCCL Yes Yes Yes Yes
Design Guide Board Dimension Max. Panel Size (inch) 10x16 10x16 10x18 10x18
Min. Panel Size (inch) 10x8 10x8 10x8 10x8
Inner Layer Min. Trace Width / Space (mil) 4/4 4/4 4/4 4/4
Max.Copper Weight (oz.) 2 3 3 3
Min.Copper Weight (oz.) 1/3 1/4 1/4 1/4
Max. FCCL Core Thickness (mil) 2 2 2 2
Min. FCCL Core Thickness (mil) 0.5 0.5 0.5 0.5
Lamination Max. Layer Count (Flex) 4 6 8 TBD
Max. Layer Count(Rigid-Flex) 8 12 TBD TBD
Drill&Plating Min. Plated Hole Size (mil) 10 8 8 8
Max. Hole Aspect Ratio 6:1 8:1 8:1 10:1
Outer Layer Min. Trace Width / Space 4/4 3/3 2.5/2.5 2.5/2.5
Available Surface Finish ENIG Yes Yes Yes Yes
Immersion Silver Yes Yes Yes Yes
Immersion Tin Yes Yes Yes Yes
OSP Yes Yes Yes Yes
Solder Mask Min. Solder Mask Thickness (mil) 0.4 0.4 0.4 0.4
Min. Solder Mask Dam Width (mil) 4 3 3 3
Routing Punch Tolerance (+/- mm) 0.1 0.1 0.1 0.1
Routing Tolerance (+/- mm) 0.2 0.15 0.1 0.1
Others Coverlayer Paste Tolerance (+/- mil) 12 10 8 6
Resinforce Paste (+/- mil) 20 16 12 12
Adhesive Paste (+/- mil) 20 16 12 12

Material for CCL & Prepreg
A) FR4 PCB
Material Items Current status Technology Readiness
E/2019 E/2020 E/2021
FR4 - High Tg  Tg = 150℃ / 170℃ / 180℃ / 215℃ Yes Yes Yes Yes
FR4 - Lead Free process  Tg = 150℃ / 170℃ / 180℃ / 215℃ Yes Yes Yes Yes
Halogen free  Tg = 150℃ Yes Yes Yes Yes
Tg = 180℃ Sample Yes Yes Yes
RF production Isola FR408 FR408HR Yes Yes Yes Yes
                             IS640 IS680 Yes Yes Yes Yes
                             I-Tera MT40        Tg = 200℃        Df = 0.0033       Dk3.75 Sample Yes Yes Yes
                            Astra MT77        Tg = 200℃        Df = 0.0017        Dk3 Sample Yes Yes Yes
Rogers RO4003 / RO4350B / RO4223 / RO4835 Yes Yes Yes Yes
                             RO3003 ( Teflon )        Dk = 3.0 Yes Yes Yes Yes
                            TU-933 Sample Yes Yes Yes
                            TU-933 Sample Yes Yes Yes
                            PegaClad1(TU-1300 E)        Tg = 220℃        Df = 0.0037        Dk3.6 Sample Yes Yes Yes
                            Panasonic  R5715/R5610G     Tg = 180 oC Sample Yes Yes Yes
EMC EM-888 Tg = 170℃ Df = 0.0055 Dk3.8 Sample Yes Yes Yes
                            EM-890        Tg = 170℃        Df = 0.0036        Dk3.0 Sample Yes Yes Yes
                            EM-890K      Tg = 170℃        Df = 0.0024        Dk2.8 Sample Yes Yes Yes

B) Metal Core PCB
Material Items Current status Technology Readiness
E/2019 E/2020 E/2021
RF production Bergquist          MP          MCPCB          k=1.3 w/mk Yes Yes Yes Yes
                             HR( T30.20)          MCPCB          k=1.3 w/mk Yes Yes Yes Yes
                             HT MCPCB          k=1.3 w/mk Yes Yes Yes Yes
NRK          NRA-8          MCPCB          k= 1.8 w/mk Yes Yes Yes Yes
                             NRA-ES1          MCPCB          k= 1.7 w/mk Yes Yes Yes Yes
EMC          EM-MP prepreg          k= 2.0 w/mk Yes Yes Yes Yes
                             EM-M1          MCPCB          k= 3.0 w/mk Yes Yes Yes Yes
NAN YA          CEM-3-01HC          CEM3/CCL          k= 1.5 w/mk Yes Yes Yes Yes
Panasonic          ECOOL          CEM3/CCL          k= 1.5 w/mk Yes Yes Yes Yes
Ventec                   VT-4A2H          prepreg          k= 2.2 w/mk Yes Yes Yes Yes
                             VT-4B          MCPCB          k=3.0          5.0 w/mk Yes Yes Yes Yes
PTTC          TCP prepreg          k= 2.0         3.0          4.0          8.0 w/mk Yes Yes Yes Yes
White colored core Risho CS-3965V Yes Yes Yes Yes
AMC AMC-820WHFE Yes Yes Yes Yes

Available Finish :  RoHS compliance
Items Current status Technology Readiness
E/2019 E/2020 E/2021
 O.S.P. Yes Yes Yes Yes
Immersion silver ( Mac Dermid )  Yes Yes Yes Yes
Immersion White Tin ( Omikron ) Yes Yes Yes Yes
Lead Free HASL Yes Yes Yes Yes
Electroless Nickel / Immersion gold  Yes Yes Yes Yes
Electroless Nickel / Electroless Padium / Immersion gold  Yes Yes Yes Yes
Carbon ink  ( Peters ) Yes Yes Yes Yes
Peelable Mask ( Peters ) Yes Yes Yes Yes
Silver Plating   Yes Yes Yes Yes
Nickel Plating   Yes Yes Yes Yes
Gold Finger Plating Yes Yes Yes Yes
Selective Plating : OSP + Gold plating Yes Yes Yes Yes
                                 OSP + ENIG   Yes Yes Yes Yes
ENIG+Gold plating Yes Yes Yes Yes